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| 基本信息 | 登录收藏 | |||||||||||||||||||||
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期刊名字 | Materials Today Electronics （此期刊被最新的JCR期刊ESCI收录） LetPub评分 0.2
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声誉 0.2 影响力 0.2 速度 0.2 | |||||||||||||||||||||
| 期刊ISSN | 2772-9494 | 安装APP，查看期刊最新消息
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| 2025-2026最新IF （数据来源于网友提供） | 注册或登录后，查看IF | |||||||||||||||||||||
| 实时影响因子 | - | |||||||||||||||||||||
| 2025-2026自引率 | 2.5%点击查看自引率趋势图 | |||||||||||||||||||||
| 五年IF （数据来源于网友提供） | 8.603数据由网友[wanderer2111]收集提供 | |||||||||||||||||||||
| h-index | 暂无h-index数据 | |||||||||||||||||||||
| CiteScore （ 2026年6月最新版） |
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| 期刊简介 |
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| 期刊官方网站 | https://www.sciencedirect.com/journal/materials-today-electronics | |||||||||||||||||||||
期刊投稿格式模板 VIP专享 |
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| 期刊投稿网址 | ||||||||||||||||||||||
| 该期刊中国学者近期发文 - New | Electrical performance of n-β-Ga2O3/p-GaN heterojunction diodes Author: Ho, Ai; Hsiao, Chien-Nan; Chung, Sheng-Ti; Rawat, Tejender Singh; Hsiao, Yi-Kai; Seong, Tae-Yeon; Kasalynas, Irmantas; Wuu, Dong-Sing; Kuo, Hao-Chung; Jarrendahl, Kenneth; Hsiao, Ching-Lien; Liu, Hsueh-Hsing; Hong, Zi-Xiang; Tsai, Chia-Lung; Horng, Ray-Hua Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100218 Suspended Graphene/LiTaO3 Pyro-FeFETs for high-sensitivity uncooled infrared detection Author: Liu, Dachuan; Zhao, Qianru; Wu, Binmin; Zheng, Yuqing; Hu, Xinfeng; Zhang, Ziyu; Cai, Tianjun; Lv, Xinyue; Teng, Guichen; Xiong, Ke; Yan, Haoran; Hu, Zhourui; Wu, Shuaiqin; Liu, Chang; Wei, Cheng; Wang, Jian; Li, Wenxin; Chen, Yan; Lin, Tie; Meng, Xiangjian; Shen, Hong; Wang, Xudong; Chu, Junhao; Wang, Jianlu Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100219 AI-enabled MOS gas sensors for applications in complex environments Author: Xiao, Cong; Han, Biguang; Zhou, Na; Shi, Meng; Mao, Haiyang Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100220 Design and construction of the interphase in SiCf/SiC composites: From mechanical performance requirements to structure-function integration Author: Jia, Hang; Liu, Shanhua; Qiu, Baowei; Liu, Zheng; Liu, Peng; Li, Mingxing; Kong, Weiyi; Wu, Yaming; Lei, Liming Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100216 | |||||||||||||||||||||
| 期刊语言要求 | Language Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service. 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件，不仅能满足Materials Today Electronics的语言要求，还能让Materials Today Electronics编辑和审稿人得到更好的审稿体验，让稿件最大限度地被Materials Today Electronics编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）帮助作者准备稿件，已助力全球15万+作者顺利发表论文。部分发表范例可查看：服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||
| 是否OA开放访问 | Yes | |||||||||||||||||||||
OA期刊相关信息 | 文章处理费：需要（ USD3000; ） 文章处理费豁免：查看说明 其他费用：没有 期刊主题关键词：electronic materials、optical and magnetic materials、electrical and electronic engineering、nano device、system applications 相关链接：Aims & ScopeAuthor InstructionsEditorial BoardAnonymous peer review | |||||||||||||||||||||
| 通讯方式 | ||||||||||||||||||||||
| 出版商 | Elsevier | |||||||||||||||||||||
| 涉及的研究方向 | Engineering-Electrical and Electronic Engineering | |||||||||||||||||||||
| 出版国家或地区 | United Kingdom | |||||||||||||||||||||
| 出版语言 | English | |||||||||||||||||||||
| 出版周期 | ||||||||||||||||||||||
| 出版年份 | 0 | |||||||||||||||||||||
| 年文章数 | 45点击查看年文章数趋势图 | |||||||||||||||||||||
| Gold OA文章占比 | 100.00% | |||||||||||||||||||||
| 研究类文章占比： 文章 ÷（文章 + 综述） | 77.78% | |||||||||||||||||||||
| 期刊分区表预警名单 | 2026年03月发布的新锐学术版：不在预警名单中 2025年03月发布的2025版：不在预警名单中 2024年02月发布的2024版：不在预警名单中 2023年01月发布的2023版：不在预警名单中 2021年12月发布的2021版：不在预警名单中 2020年12月发布的2020版：不在预警名单中 | |||||||||||||||||||||
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| 《新锐期刊分区表》 （ 2026年3月发布） | 点击查看期刊分区表趋势图
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| 期刊分区表 （ 2025年3月升级版） | （没有被2025年的期刊分区表收录，仅供参考） | |||||||||||||||||||||
| 期刊分区表 （ 2023年12月旧的升级版） | （没有被旧的期刊分区表收录，仅供参考） | |||||||||||||||||||||
| SCI期刊收录coverage | Emerging Sources Citation Index (ESCI) Scopus (CiteScore) Directory of Open Access Journals (DOAJ) | |||||||||||||||||||||
| PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2772-9494%5BISSN%5D | |||||||||||||||||||||
| 平均审稿速度 | 网友分享经验： 12 Weeks | |||||||||||||||||||||
| 平均录用比例 | 网友分享经验： | |||||||||||||||||||||
| 版面费/APC文章处理费信息 | 文章处理费：需要（ USD3000; ） 文章处理费豁免：查看说明 其他费用：没有 LetPub提供文章处理费（APC）支持服务，可以用人民币支付版面费啦！ | |||||||||||||||||||||
| LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍，平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）后论文在Materials Today Electronics顺利发表。
快看看作者怎么说吧：服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||
| 期刊常用信息链接 |
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| 中国学者近期发表的论文 | |
| 1. | Electrical performance of n-β-Ga2O3/p-GaN heterojunction diodes Author: Ho, Ai; Hsiao, Chien-Nan; Chung, Sheng-Ti; Rawat, Tejender Singh; Hsiao, Yi-Kai; Seong, Tae-Yeon; Kasalynas, Irmantas; Wuu, Dong-Sing; Kuo, Hao-Chung; Jarrendahl, Kenneth; Hsiao, Ching-Lien; Liu, Hsueh-Hsing; Hong, Zi-Xiang; Tsai, Chia-Lung; Horng, Ray-Hua Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100218 DOI |
| 2. | Suspended Graphene/LiTaO3 Pyro-FeFETs for high-sensitivity uncooled infrared detection Author: Liu, Dachuan; Zhao, Qianru; Wu, Binmin; Zheng, Yuqing; Hu, Xinfeng; Zhang, Ziyu; Cai, Tianjun; Lv, Xinyue; Teng, Guichen; Xiong, Ke; Yan, Haoran; Hu, Zhourui; Wu, Shuaiqin; Liu, Chang; Wei, Cheng; Wang, Jian; Li, Wenxin; Chen, Yan; Lin, Tie; Meng, Xiangjian; Shen, Hong; Wang, Xudong; Chu, Junhao; Wang, Jianlu Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100219 DOI |
| 3. | AI-enabled MOS gas sensors for applications in complex environments Author: Xiao, Cong; Han, Biguang; Zhou, Na; Shi, Meng; Mao, Haiyang Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100220 DOI |
| 4. | Design and construction of the interphase in SiCf/SiC composites: From mechanical performance requirements to structure-function integration Author: Jia, Hang; Liu, Shanhua; Qiu, Baowei; Liu, Zheng; Liu, Peng; Li, Mingxing; Kong, Weiyi; Wu, Yaming; Lei, Liming Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100216 DOI |
| 5. | Interface-engineered Ga2O3 photodetectors with quantum-dot-assisted band modulation for spectrum-selective UVC detection Author: Li, Xiaoxi; Zhou, Yang; Wu, Zhifan; Wang, Yu; Li, Shuo; Yang, Yingguo; Huang, Shuqi; Fang, Cizhe; Zeng, Xiangyu; Dong, Bitao; Chen, Gengsheng; Mao, Wei; Liu, Yan; Hao, Yue; Han, Genquan Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100217 DOI |
| 6. | Advances in indium antimonide (InSb): A comprehensive review of properties, preparation methods, and photodetection Author: Li, Yucheng; Jia, Bowen; Li, Wenxin; Yin, Ruotong; Yang, Boyu; Zhang, Chao; Wen, Wanli; Wang, Xudong; Chen, Yan; Wang, Jianlu; Tong, Jinchao; Chu, Junhao Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100210 DOI |
| 7. | AI-driven multi-property prediction and manufacturability-aware design for electronic materials and devices Author: Zhang, Shujian; Wu, Sihan; Su, Hang; Han, Yanqiang; Li, Jinjin Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100209 DOI |
| 8. | A fully integrative multimodal biosensing system for real-time assessment of hypoxic metabolism and pressure ulcers risk Author: Wang, Xiaofeng; Shi, Hongxu; Xu, Hao; Qin, Xiaokun; Yuan, Ying; Deng, Fei; Wang, Zhaokun; Li, Zhexin; Li, Linlin; Lou, Zheng; Han, Wei; Wang, Lili Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100212 DOI |
| 9. | Recent advances in rolled-up on-chip devices Author: Chen, Li; Chi, Yuhang; Liu, Shengbao; Huang, Gaoshan; Mei, Yongfeng; Cui, Jizhai Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100213 DOI |
| 10. | Polycrystalline diamond heteroepitaxy on the third-generation semiconductors for thermal dissipation Author: Li, Yabing; Fang, Yutao; Cai, Ziling; Luan, Tiantian; Sang, Liwen Journal: MATERIALS TODAY ELECTRONICS. 2026; Vol. 16, Issue , pp. -. DOI: 10.1016/j.mtelec.2026.100207 DOI |
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