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| 基本信息 | 登录收藏 | |||||||||||||||||||||
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期刊名字![]() | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS J MICROELECTROMECH S (此期刊被最新的JCR期刊SCIE收录) LetPub评分 7.0
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声誉 7.8 影响力 5.9 速度 9.2 | |||||||||||||||||||||
| 期刊ISSN | 1057-7157 | 安装APP,查看期刊最新消息
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| E-ISSN | 1941-0158 | |||||||||||||||||||||
| 2025-2026最新IF (数据来源于网友提供) | 注册或登录后,查看IF | |||||||||||||||||||||
| 实时影响因子 | 截止2026年5月06日:3.44 | |||||||||||||||||||||
| 2025-2026自引率 | 11.4%点击查看自引率趋势图 | |||||||||||||||||||||
| 五年IF (数据来源于网友提供) | 3.405数据由网友[冰淇淋1585]收集提供 | |||||||||||||||||||||
| h-index | 131 | |||||||||||||||||||||
| CiteScore ( 2026年6月最新版) |
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| 期刊简介 |
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| 期刊官方网站 | http://eds.ieee.org/journal-of-microelectromechanical-systems.html | |||||||||||||||||||||
期刊投稿格式模板 VIP专享 |
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| 期刊投稿网址 | https://mc.manuscriptcentral.com/jmems | |||||||||||||||||||||
| 该期刊中国学者近期发文 - New | A MEMS Piezoresistive Micro-Pressure Sensor With Ultra-Low Nonlinearity Over a Wide Operating Temperature Range Author: Zhang, Pengfei; Wang, Chengyu; Cheng, Xiong; Lan, Zhikang; Jiao, Xiangkun; Dou, Zechun; Guo, Jian; Chen, Can; Li, Xiaobo; Li, Weiping; Sun, Daying; Huang, Xiaodong Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3683203 High-Coupling Thickness-Shear Mode Solidly Mounted Resonator Using Y-cut LiNbO3 Thin Film via Transfer Bonding Author: Wang, Ronghui; Zeng, Min; Liu, Wenjuan; Wen, Zhiwei; Cai, Yao; Guo, Shishang; Wu, Guoqiang; Sun, Chengliang Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3683689 Hybrid Electrostatic-Axial Force Tuning for Mode Matching in Piezo-MEMS Pitch or Roll Gyroscopes Author: Qi, Zhenxiang; Gu, Jie; Zhai, Zhaoyang; Wang, Kunfeng; Yang, Wuhao; Bie, Xiaorui; Wang, Yao; Zou, Xudong Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3686244 Dual-Mode Surface Sensing Based on Piezoelectric Micromachined Ultrasonic Transducer Array Author: Wang, Junhao; Yang, Kai; Zhang, Chenyuan; Xia, Jiao; Gao, Yufeng; Zhang, Xinyue; Wang, Wei; Sheng, Bowen; Lu, Yipeng Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3687903 | |||||||||||||||||||||
| 期刊语言要求 | 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足JOURNAL OF MICROELECTROMECHANICAL SYSTEMS的语言要求,还能让JOURNAL OF MICROELECTROMECHANICAL SYSTEMS编辑和审稿人得到更好的审稿体验,让稿件最大限度地被JOURNAL OF MICROELECTROMECHANICAL SYSTEMS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色,同行资深专家修改润色,SCI论文专业翻译,SCI论文格式排版,专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢 。
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| 是否OA开放访问 | No | |||||||||||||||||||||
| 通讯方式 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 | |||||||||||||||||||||
| 出版商 | Institute of Electrical and Electronics Engineers Inc. | |||||||||||||||||||||
| 涉及的研究方向 | 工程技术-工程:电子与电气 | |||||||||||||||||||||
| 出版国家或地区 | UNITED STATES | |||||||||||||||||||||
| 出版语言 | English | |||||||||||||||||||||
| 出版周期 | Bimonthly | |||||||||||||||||||||
| 出版年份 | 1992 | |||||||||||||||||||||
| 年文章数 | 104点击查看年文章数趋势图 | |||||||||||||||||||||
| Gold OA文章占比 | 6.69% | |||||||||||||||||||||
| 研究类文章占比: 文章 ÷(文章 + 综述) | 100.00% | |||||||||||||||||||||
| 期刊分区表预警名单 | 2026年03月发布的新锐学术版:不在预警名单中 2025年03月发布的2025版:不在预警名单中 2024年02月发布的2024版:不在预警名单中 2023年01月发布的2023版:不在预警名单中 2021年12月发布的2021版:不在预警名单中 2020年12月发布的2020版:不在预警名单中 | |||||||||||||||||||||
| 《新锐期刊分区表》 ( 2026年3月发布) | 点击查看期刊分区表趋势图
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| 期刊分区表 ( 2025年3月升级版) |
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| 期刊分区表 ( 2023年12月旧的升级版) |
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| SCI期刊收录coverage | Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE) Scopus (CiteScore) | |||||||||||||||||||||
| PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1057-7157%5BISSN%5D | |||||||||||||||||||||
| 平均审稿速度 | 网友分享经验: 平均3.0个月 | |||||||||||||||||||||
| 平均录用比例 | 网友分享经验: 较易 | |||||||||||||||||||||
| LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色,同行资深专家修改润色,SCI论文专业翻译,SCI论文格式排版,专业学术制图等)后论文在JOURNAL OF MICROELECTROMECHANICAL SYSTEMS顺利发表。
快看看作者怎么说吧:服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||
| 期刊常用信息链接 | ||||||||||||||||||||||
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| 中国学者近期发表的论文 | |
| 1. | A MEMS Piezoresistive Micro-Pressure Sensor With Ultra-Low Nonlinearity Over a Wide Operating Temperature Range Author: Zhang, Pengfei; Wang, Chengyu; Cheng, Xiong; Lan, Zhikang; Jiao, Xiangkun; Dou, Zechun; Guo, Jian; Chen, Can; Li, Xiaobo; Li, Weiping; Sun, Daying; Huang, Xiaodong Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3683203 DOI |
| 2. | High-Coupling Thickness-Shear Mode Solidly Mounted Resonator Using Y-cut LiNbO3 Thin Film via Transfer Bonding Author: Wang, Ronghui; Zeng, Min; Liu, Wenjuan; Wen, Zhiwei; Cai, Yao; Guo, Shishang; Wu, Guoqiang; Sun, Chengliang Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3683689 DOI |
| 3. | Hybrid Electrostatic-Axial Force Tuning for Mode Matching in Piezo-MEMS Pitch or Roll Gyroscopes Author: Qi, Zhenxiang; Gu, Jie; Zhai, Zhaoyang; Wang, Kunfeng; Yang, Wuhao; Bie, Xiaorui; Wang, Yao; Zou, Xudong Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3686244 DOI |
| 4. | Dual-Mode Surface Sensing Based on Piezoelectric Micromachined Ultrasonic Transducer Array Author: Wang, Junhao; Yang, Kai; Zhang, Chenyuan; Xia, Jiao; Gao, Yufeng; Zhang, Xinyue; Wang, Wei; Sheng, Bowen; Lu, Yipeng Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3687903 DOI |
| 5. | MEMS Microheater With Fast Electrothermal Response for Self-Destructing Chip Applications Author: He, Haoran; Ma, Wanli; Fan, Zhiqiang; Xu, Kai; Kang, Zhiqiang; Zhao, Wei; Zhang, Le; Qiao, Xiaojun; Geng, Wenping Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3674741 DOI |
| 6. | A Novel Comprehensive Parametric Macromodeling Method for MEMS Sensors Based on the Reduced-Order State-Space Models and Machine Learning Approaches Author: Xu, Hao; Mo, Yun-Cong; Zhang, Hao-Dong; Wen, Jun-Jie; Zhou, Zai-Fa; Huang, Qing-An Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3677815 DOI |
| 7. | A Nano-g MEMS Accelerometer With Electrostatic Anti-Spring Based on SOI Technology Author: Cao, Jianxia; Cao, Kangda; Zhou, Yang; Pei, Zhe; Ouyang, Hao; Zhao, Kunwei; Zhang, Shaolin; Yu, Kan; Wu, Wenjie; Liu, Huafeng; Liu, Jinquan Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3676738 DOI |
| 8. | Analysis of Brittle Fracture Characteristics Under Static/Dynamic Loads in Silicon-Based MEMS Cantilevers Author: Yang, Mo; Cheng, Baolin; Nie, Weirong; Shi, Mingyuyi; Lei, Shenghong; Wang, He; Dai, Shijuan; Cao, Yun Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3679568 DOI |
| 9. | A Novel Optimization and Yield Analysis Method for MEMS Devices Combining Bi-Fidelity Deep Neural Network and Active Subspace Author: Zhao, Lin-Feng; Liu, Gong-Zeng; Mo, Yun-Cong; Wang, He; Huang, Qing-An; Zhou, Zai-Fa Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3667598 DOI |
| 10. | Low-Loss and Ultra-Wideband SAW Filters Using LiNbO3/Si Structure Author: Xu, Qiufeng; Shen, Junyao; Xie, Shouren; Shen, Quhuan; Pan, Feng Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3669513 DOI |
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