2026年3月最新《新锐期刊分区表》数据已更新，欢迎查询使用。如果您对期刊系统有任何需求或者问题，欢迎反馈给我们。
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期刊名字 | IEEE Transactions on Components Packaging and Manufacturing Technology IEEE T COMP PACK MAN （此期刊被最新的JCR期刊SCIE收录） LetPub评分 6.3
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声誉 6.9 影响力 5.4 速度 7.7 | |||||||||||||||||||||||||||||||||||||||||
| 期刊ISSN | 2156-3950 | 安装APP，查看期刊最新消息
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| 2024-2025最新影响因子 （数据来源于搜索引擎） | 3 点击查看影响因子趋势图 | |||||||||||||||||||||||||||||||||||||||||
| 实时影响因子 | 截止2026年5月06日：3.25 | |||||||||||||||||||||||||||||||||||||||||
| 2024-2025自引率 | 13.3%点击查看自引率趋势图 | |||||||||||||||||||||||||||||||||||||||||
| 五年影响因子 | 2.7 | |||||||||||||||||||||||||||||||||||||||||
| JCI期刊引文指标 | 0.56 | |||||||||||||||||||||||||||||||||||||||||
| h-index | 39 | |||||||||||||||||||||||||||||||||||||||||
| CiteScore （ 2025年最新版） |
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| 期刊简介 |
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| 期刊官方网站 | https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT | |||||||||||||||||||||||||||||||||||||||||
期刊投稿格式模板 VIP专享 |
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| 期刊投稿网址 | ||||||||||||||||||||||||||||||||||||||||||
| 该期刊中国学者近期发文 - New | Multilayer Packaging Quad-Mode SIW Cavity-Based Dual-Band-Per-Channel Diplexer Author: Zhou, Xin; Zhang, Gang; Jiang, Chaoyu; Zhang, Zheyi; Zhang, Zhuowei; Wang, Wenbin; Tam, Kam-Weng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 630-633. DOI: 10.1109/TCPMT.2026.3660276 Uncertainty Quantification of Multiphysics Field Coupling Effects in Self-Packaged Substrate Integrated Suspended Line (SISL) Components Author: Zhao, Dongyan; Zhang, Hao-Xuan; Guo, Shi-Wei; Zhang, Jingwei; Jin, Kaiyuan; Wang, Yi-Yao; Chen, Yanning; Liang, Yingzong; Liu, Fang; Xie, Hao; Yin, Wen-Yan Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 563-574. DOI: 10.1109/TCPMT.2025.3596298 QMSIW Filtering Balun Using IPD Technology for High-Frequency Applications Author: Zhang, Li; Wang, Yingjie; Zhou, Chunxia; Wu, Wen Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 627-629. DOI: 10.1109/TCPMT.2026.3655321 Simultaneous Nondestructive Thickness and Acoustic Parameter Determination of Sandwiched Thermal Interface Material Using Ultrasonic Reflection Coefficient Spectroscopy Author: Yao, Zhijun; Cao, Huanqing; Zhu, Qimin; Zeng, Xiaoliang; Su, Zhoucheng; Yeen Gavin Lai, Nai; Yang, Jian; Guo, Shifeng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 609-617. DOI: 10.1109/TCPMT.2026.3660052 | |||||||||||||||||||||||||||||||||||||||||
| 期刊语言要求 | 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件，不仅能满足IEEE Transactions on Components Packaging and Manufacturing Technology的语言要求，还能让IEEE Transactions on Components Packaging and Manufacturing Technology编辑和审稿人得到更好的审稿体验，让稿件最大限度地被IEEE Transactions on Components Packaging and Manufacturing Technology编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）帮助作者准备稿件，已助力全球15万+作者顺利发表论文。部分发表范例可查看：服务好评 论文致谢 。
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| 是否OA开放访问 | No | |||||||||||||||||||||||||||||||||||||||||
| 通讯方式 | 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 | |||||||||||||||||||||||||||||||||||||||||
| 出版商 | Institute of Electrical and Electronics Engineers Inc. | |||||||||||||||||||||||||||||||||||||||||
| 涉及的研究方向 | ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC | |||||||||||||||||||||||||||||||||||||||||
| 出版国家或地区 | UNITED STATES | |||||||||||||||||||||||||||||||||||||||||
| 出版语言 | English | |||||||||||||||||||||||||||||||||||||||||
| 出版周期 | ||||||||||||||||||||||||||||||||||||||||||
| 出版年份 | 2011 | |||||||||||||||||||||||||||||||||||||||||
| 年文章数 | 255点击查看年文章数趋势图 | |||||||||||||||||||||||||||||||||||||||||
| Gold OA文章占比 | 4.48% | |||||||||||||||||||||||||||||||||||||||||
| 研究类文章占比： 文章 ÷（文章 + 综述） | 99.61% | |||||||||||||||||||||||||||||||||||||||||
| WOS期刊JCR分区 （ 2024-2025年最新版） | WOS分区等级：2区
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| 期刊分区表预警名单 | 2026年03月发布的新锐学术版：不在预警名单中 2025年03月发布的2025版：不在预警名单中 2024年02月发布的2024版：不在预警名单中 2023年01月发布的2023版：不在预警名单中 2021年12月发布的2021版：不在预警名单中 2020年12月发布的2020版：不在预警名单中 | |||||||||||||||||||||||||||||||||||||||||
| 《新锐期刊分区表》 （ 2026年3月发布） | 点击查看期刊分区表趋势图
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| 期刊分区表 （ 2025年3月升级版） |
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| 期刊分区表 （ 2023年12月旧的升级版） |
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| SCI期刊收录coverage | Science Citation Index Expanded (SCIE) (2020年1月，原SCI撤销合并入SCIE，统称SCIE) Scopus (CiteScore) | |||||||||||||||||||||||||||||||||||||||||
| PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D | |||||||||||||||||||||||||||||||||||||||||
| 平均审稿速度 | 网友分享经验： 一般,3-6周 | |||||||||||||||||||||||||||||||||||||||||
| 平均录用比例 | 网友分享经验： 容易 | |||||||||||||||||||||||||||||||||||||||||
| LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍，平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）后论文在IEEE Transactions on Components Packaging and Manufacturing Technology顺利发表。
快看看作者怎么说吧：服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||||||||||||||||||||||
| 期刊常用信息链接 | ||||||||||||||||||||||||||||||||||||||||||
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| 中国学者近期发表的论文 | |
| 1. | Multilayer Packaging Quad-Mode SIW Cavity-Based Dual-Band-Per-Channel Diplexer Author: Zhou, Xin; Zhang, Gang; Jiang, Chaoyu; Zhang, Zheyi; Zhang, Zhuowei; Wang, Wenbin; Tam, Kam-Weng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 630-633. DOI: 10.1109/TCPMT.2026.3660276 DOI |
| 2. | Uncertainty Quantification of Multiphysics Field Coupling Effects in Self-Packaged Substrate Integrated Suspended Line (SISL) Components Author: Zhao, Dongyan; Zhang, Hao-Xuan; Guo, Shi-Wei; Zhang, Jingwei; Jin, Kaiyuan; Wang, Yi-Yao; Chen, Yanning; Liang, Yingzong; Liu, Fang; Xie, Hao; Yin, Wen-Yan Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 563-574. DOI: 10.1109/TCPMT.2025.3596298 DOI |
| 3. | QMSIW Filtering Balun Using IPD Technology for High-Frequency Applications Author: Zhang, Li; Wang, Yingjie; Zhou, Chunxia; Wu, Wen Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 627-629. DOI: 10.1109/TCPMT.2026.3655321 DOI |
| 4. | Simultaneous Nondestructive Thickness and Acoustic Parameter Determination of Sandwiched Thermal Interface Material Using Ultrasonic Reflection Coefficient Spectroscopy Author: Yao, Zhijun; Cao, Huanqing; Zhu, Qimin; Zeng, Xiaoliang; Su, Zhoucheng; Yeen Gavin Lai, Nai; Yang, Jian; Guo, Shifeng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 609-617. DOI: 10.1109/TCPMT.2026.3660052 DOI |
| 5. | Solenoid-Type PCB-Integrated Inductors Based on Embedded Multilayer Magnetic Thin Films Author: Xue, Chengle; Zheng, Kaicheng; Chen, Yijun; Jin, Qiao; Cheng, Mengjie; Wang, Xiaoan; Tian, Chen; Liu, Lei; Zhang, Zhengmin; Ye, Tingcong; Ren, Hong; Wang, Ningning Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 547-554. DOI: 10.1109/TCPMT.2026.3657822 DOI |
| 6. | Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding Author: Xi, Yang; Wang, Shizhao; Tian, Zhiqiang; Zhang, Shi; Dong, Fang; Liu, Sheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 618-626. DOI: 10.1109/TCPMT.2026.3659942 DOI |
| 7. | PI-ONet: A Physics-Informed Operator Network for Efficient Thermal Analysis of Multilayer Chiplets Author: Sha, Yanliang; Zhang, Chengxin; Chen, Quan Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 493-505. DOI: 10.1109/TCPMT.2025.3621061 DOI |
| 8. | A Compact Wideband Marchand Balun Based on Novel Three-Coupled-Line Transformer Structure Author: Qi, Yanzhu; Cao, Yazi; Yuan, Bo; Ren, Qixiang; Xin, Jialong; Chen, Shichang; Wang, Gaofeng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 541-546. DOI: 10.1109/TCPMT.2026.3662698 DOI |
| 9. | A 3-D Printing Filter for High-Power Satellite Applications Author: Li, Yun; Li, Yafeng; Li, Bin; Feng, Guobao; Li, Xiaojun; Wen, Xiaozhu; Guo, Cheng; Yu, Ming Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 459-467. DOI: 10.1109/TCPMT.2026.3662673 DOI |
| 10. | Electrical Modeling and Discontinuity Optimization of Truncated Spherical Bump-CTSV Structure Author: Lei, Xinqing; Dong, Gang; Zhi, Changle; Zhou, Ziyu; Liu, Xiaoxian; Zhu, Zhangming Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 3, pp. 584-592. DOI: 10.1109/TCPMT.2025.3625982 DOI |
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