推荐同事 机构合作 中文 繁體中文 English 한국어 日本語 Português Español

美国ACCDON公司旗下品牌

021-33361733,021-34243363

chinasupport@letpub.com

登录 注册 新注册优惠

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

2024年6月最新影响因子数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 MAT SCI SEMICON最新评论:返修完成,已经接收。非常感谢 (2024-09-18)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中国科学院分区:   是否OA期刊:   结果排序:

同行评审状态查询 Manuscript Number * Last Name * First Name * 出版社 * 查 询 重 置

按研究方向查看:


MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊基本信息Hello,您是该期刊的第209515位访客


基本信息 登录收藏
期刊名字MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSINGMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

MAT SCI SEMICON PROC
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
7.2
78人评分
我要评分

声誉
7.7

影响力
6.2

速度
8.8

期刊ISSN1369-8001
微信扫码收藏此期刊
2023-2024最新影响因子
(数据来源于搜索引擎)
4.2 点击查看影响因子趋势图
实时影响因子 截止2024年3月26日:4.176
2023-2024自引率4.80%点击查看自引率趋势图
五年影响因子3.9
JCI期刊引文指标 0.91
h-index 49
CiteScore
2024年最新版
CiteScoreSJRSNIPCiteScore排名
8.000.7320.992
学科分区排名百分位
大类:Engineering
小类:Mechanical Engineering
Q187 / 672
大类:Engineering
小类:Condensed Matter Physics
Q159 / 434
大类:Engineering
小类:Mechanics of Materials
Q160 / 398
大类:Engineering
小类:General Materials Science
Q1100 / 463

期刊简介
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
期刊官方网站https://www.journals.elsevier.com/materials-science-in-semiconductor-processing
期刊投稿网址https://www.editorialmanager.com/MSSP
期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING的语言要求,还能让MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评(1篇) 论文致谢
提交文稿
是否OA开放访问No
通讯方式ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
出版商Elsevier Ltd
涉及的研究方向工程技术-材料科学:综合
出版国家或地区ENGLAND
出版语言English
出版周期Bimonthly
出版年份0
年文章数 635点击查看年文章数趋势图
Gold OA文章占比5.21%
研究类文章占比:
文章 ÷(文章 + 综述)
96.22%
WOS期刊SCI分区
2023-2024年最新版
WOS分区等级:2区

按JIF指标学科分区收录子集JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ289/352
学科:MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ2158/438
学科:PHYSICS, APPLIEDSCIEQ251/179
学科:PHYSICS, CONDENSED MATTERSCIEQ225/79
按JCI指标学科分区收录子集JCI分区JCI排名JCI百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2113/354
学科:MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ2125/438
学科:PHYSICS, APPLIEDSCIEQ247/179
学科:PHYSICS, CONDENSED MATTERSCIEQ119/79
中国科学院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
中国科学院SCI期刊分区
2023年12月最新升级版
点击查看中国科学院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
工程技术 2区3区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区4区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
2区1区3区
PHYSICS, APPLIED
物理:应用
1区3区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
4区3区3区
中国科学院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
工程技术 2区3区4区
PHYSICS, APPLIED
物理:应用
1区1区2区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
4区4区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区1区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区1区3区
中国科学院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 3区3区1区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
1区2区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区4区3区
PHYSICS, APPLIED
物理:应用
1区4区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区1区3区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
平均审稿速度网友分享经验:
平均1.7个月
来源Elsevier官网:
平均3.7周
平均录用比例网友分享经验:
约88.33%
来源Elsevier官网:
15%
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
在线出版周期来源Elsevier官网:
平均4.1周
期刊常用信息链接
同领域相关期刊 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING中国科学院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中国科学院分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发文
  • 中国科学院分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    Nature Nanotechnology28659.70
    NATURE MATERIALS40362.20
    PROGRESS IN MATERIALS SCIENCE14459.60
    MATERIALS SCIENCE & ENGINEERING R-REPORTS12960.50
    ADVANCED MATERIALS44743.00
    Materials Today13836.30
    ADVANCED FUNCTIONAL MATERIALS26929.50
    INTERNATIONAL MATERIALS REVIEWS9528.50
    ACS Nano31026.00
    Nano Today11921.50
    中国科学院SCI期刊分区同大类学科的热搜期刊 浏览次数
    Chemical Engineering Journal3647802
    Energy1503687
    Fuel1379162
    APPLIED ENERGY1316284
    Construction and Building Materials1145651
    JOURNAL OF POWER SOURCES1020049
    MEASUREMENT1014169
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH981983
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT955334
    INTERNATIONAL JOURNAL OF HYDROGEN ENERGY946207
  •  

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
  •  

     
  •  

     
  •  

     
  • 中国学者近期发表的论文
    1.V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance

    Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 155, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107265
        DOI
    2.Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration

    Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107272
        DOI
    3.Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration

    Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107267
        DOI
    4.Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling

    Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107274
        DOI
    5.Fabrication of interface-engineered Ni/NiO/rGO nanobush for highly efficient and durable oxygen reduction

    Author: Wang, Yanan; Duan, Chunyang; Li, Junhua; Zhao, Zenghua; Xu, Jiasheng; Liu, Lin; Qian, Jianhua
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107259
        DOI
    6.The structural, mechanical and electronic properties of BaxNy compounds

    Author: Wang, Gao-Min; Zeng, Wei; Zhang, Fan; Li, Xing-Han; Liu, Fu-Sheng; Tang, Bin; Zhong, Mi; Liu, Qi-Jun
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107268
        DOI
    7.Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium- based copper interconnected and the surface action mechanism analysis

    Author: Luo, Fu; Niu, Xinhuan; Yan, Han; Zhang, Yinchan; Qu, Minghui; Zhu, Yebo; Hou, Ziyang
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107276
        DOI
    8.Hyperspectral camouflage coating using Palygorskite to simulate water absorption of healthy green leaves

    Author: Lu, Haipeng; Bai, Xingzhi; Wang, Zhenxiong; Guo, Yang; Zhang, Li; Weng, Xiaolong; Xie, Jianliang; Liang, Difei; Deng, Longjiang
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107293
        DOI
    9.Effects of (Bi0.5Li0.5)TiO3 addition on microstructures, electrical properties and thermal stability of BiFeO3-BaTiO3 piezoelectric ceramics

    Author: Guan, Shibo; Yang, Huabin; Cheng, Shuai; Chen, Qiaohong; Yuan, Linna; Liu, Xiao; Yang, Ling; Liu, Guiwu; Qiao, Guanjun
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107286
        DOI
    10.Gas-sensing performance of Au loading Sn0.97Cu0.03O2 and its use on quantifying CO and H2 concentration by BP-temperature modulation method

    Author: Zhang, Li-Sheng; Du, Yu; Guo, Xing-Min
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107291
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Electronics047.50
    PROGRESS IN ENERGY AND COMBUSTION SCIENCE16159.30
    Annual Review of Fluid Mechanics16354.00
    Advanced Fiber Materials018.70
    IEEE Reviews in Biomedical Engineering031.70
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS22231.20
    International Journal of Extreme Manufacturing017.70
    eTransportation019.80
    TRENDS IN BIOTECHNOLOGY19528.60
    IEEE Transactions on Intelligent Vehicles012.10
    同分区等级的其他期刊名称 h-index CiteScore
    Computational Visual Media016.90
    Industrial and Organizational Psychology-Perspectives on Science and Practice07.70
    COMMUNICATIONS OF THE ACM18916.10
    MedComm06.70
    Journal of Econometrics1358.60
    CLINICAL NUCLEAR MEDICINE532.90
    Journal of International Financial Management & Accounting09.10
    BMJ Evidence-Based Medicine08.90
    ARCHIVOS DE BRONCONEUMOLOGIA413.50
    ARCHIVOS DE BRONCONEUMOLOGIA463.50
以上SCI期刊相关数据和信息来源于网络,仅供参考。
投稿状态统计: 我要评分:

同领域作者分享投稿经验:共76


    联系我们 | 站点地图 | 友情链接 | 授权代理商 | 加入我们

    © 2010-2024 中国: LetPub上海    网站备案号:沪ICP备10217908号-1    沪公网安备号:31010402006960 (网站)31010405000484 (蝌蝌APP)

    增值电信业务经营许可证:沪B2-20211595    网络文化经营许可证:沪网文[2023]2004-152号

    礼翰商务信息咨询(上海)有限公司      办公地址:上海市徐汇区漕溪北路88号圣爱大厦1803室