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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

2023年12月最新中科院分区表数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 MAT SCI SEMICON最新评论:修改了两次,每次修稿后大约1个月给意见。编辑处理很速度。祝期刊越办越好。 (2023-12-28)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊基本信息Hello,您是该期刊的第191036位访客

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期刊名字MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSINGMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

MAT SCI SEMICON PROC
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
7.1
69人评分
我要评分

声誉
7.8

影响力
6.1

速度
9.0

期刊ISSN1369-8001
微信扫码收藏此期刊
2022-2023最新影响因子
(数据来源于搜索引擎)
4.1 点击查看影响因子趋势图
实时影响因子 截止2023年12月27日:3.552
2022-2023自引率4.90%点击查看自引率趋势图
五年影响因子3.7
h-index 49
CiteScore
CiteScoreSJRSNIPCiteScore排名
7.000.6881.014
学科分区排名百分位
大类:Engineering
小类:Mechanical Engineering
Q194 / 631
大类:Engineering
小类:Condensed Matter Physics
Q168 / 423
大类:Engineering
小类:Mechanics of Materials
Q166 / 391
大类:Engineering
小类:General Materials Science
Q1105 / 453

期刊简介
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
期刊官方网站http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description
期刊投稿网址https://www.editorialmanager.com/MSSP
期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING的语言要求,还能让MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢
提交文稿
是否OA开放访问No
通讯方式ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
出版商Elsevier Ltd
涉及的研究方向工程技术-材料科学:综合
出版国家或地区ENGLAND
出版语言English
出版周期Bimonthly
出版年份0
年文章数 706点击查看年文章数趋势图
Gold OA文章占比1.45%
研究类文章占比:
文章 ÷(文章 + 综述)
97.45%
WOS期刊SCI分区
2022-2023年最新版
WOS分区等级:2区

按学科分区JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC
类别:SCIE
Q297/275
学科:MATERIALS SCIENCE, MULTIDISCIPLINARY
类别:SCIE
Q2138/342
学科:PHYSICS, APPLIED
类别:SCIE
Q244/159
学科:PHYSICS, CONDENSED MATTER
类别:SCIE
Q220/66
中科院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
中科院SCI期刊分区
2023年12月最新升级版
点击查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
工程技术 4区3区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区4区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区3区3区
PHYSICS, APPLIED
物理:应用
3区4区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
4区4区3区
中科院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
工程技术 4区3区2区
PHYSICS, APPLIED
物理:应用
1区3区2区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
3区4区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区3区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区4区3区
中科院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 4区3区1区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区2区3区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区2区3区
PHYSICS, APPLIED
物理:应用
4区2区3区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区1区3区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
平均审稿速度网友分享经验:
平均1.7个月
来源Elsevier官网:
平均3.7周
平均录用比例网友分享经验:
约88.33%
来源Elsevier官网:
15%
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
在线出版周期来源Elsevier官网:
平均4.1周
期刊常用信息链接
同领域相关期刊 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    NATURE MATERIALS40358.30
    Nature Nanotechnology28654.60
    PROGRESS IN MATERIALS SCIENCE14467.50
    MATERIALS SCIENCE & ENGINEERING R-REPORTS12956.10
    ADVANCED MATERIALS44745.50
    Materials Today13833.50
    ADVANCED FUNCTIONAL MATERIALS26927.90
    Nano Today11919.40
    ACS Nano31025.40
    INTERNATIONAL MATERIALS REVIEWS9533.10
    中科院SCI期刊分区同大类学科的热搜期刊 浏览次数
    Chemical Engineering Journal3255555
    Energy1290615
    Fuel1254041
    APPLIED ENERGY1174260
    Construction and Building Materials1015214
    JOURNAL OF POWER SOURCES947343
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH932542
    MEASUREMENT863827
    INTERNATIONAL JOURNAL OF HYDROGEN ENERGY856428
    ENERGY & FUELS821502
  •  

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
  •  

     
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  • 中国学者近期发表的论文
    1.V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance

    Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 155, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107265
        DOI
    2.Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration

    Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107272
        DOI
    3.Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration

    Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107267
        DOI
    4.Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling

    Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107274
        DOI
    5.Fabrication of interface-engineered Ni/NiO/rGO nanobush for highly efficient and durable oxygen reduction

    Author: Wang, Yanan; Duan, Chunyang; Li, Junhua; Zhao, Zenghua; Xu, Jiasheng; Liu, Lin; Qian, Jianhua
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107259
        DOI
    6.The structural, mechanical and electronic properties of BaxNy compounds

    Author: Wang, Gao-Min; Zeng, Wei; Zhang, Fan; Li, Xing-Han; Liu, Fu-Sheng; Tang, Bin; Zhong, Mi; Liu, Qi-Jun
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107268
        DOI
    7.Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium- based copper interconnected and the surface action mechanism analysis

    Author: Luo, Fu; Niu, Xinhuan; Yan, Han; Zhang, Yinchan; Qu, Minghui; Zhu, Yebo; Hou, Ziyang
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107276
        DOI
    8.Hyperspectral camouflage coating using Palygorskite to simulate water absorption of healthy green leaves

    Author: Lu, Haipeng; Bai, Xingzhi; Wang, Zhenxiong; Guo, Yang; Zhang, Li; Weng, Xiaolong; Xie, Jianliang; Liang, Difei; Deng, Longjiang
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107293
        DOI
    9.Effects of (Bi0.5Li0.5)TiO3 addition on microstructures, electrical properties and thermal stability of BiFeO3-BaTiO3 piezoelectric ceramics

    Author: Guan, Shibo; Yang, Huabin; Cheng, Shuai; Chen, Qiaohong; Yuan, Linna; Liu, Xiao; Yang, Ling; Liu, Guiwu; Qiao, Guanjun
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107286
        DOI
    10.Gas-sensing performance of Au loading Sn0.97Cu0.03O2 and its use on quantifying CO and H2 concentration by BP-temperature modulation method

    Author: Zhang, Li-Sheng; Du, Yu; Guo, Xing-Min
    Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107291
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    Nature Electronics038.30
    PROGRESS IN ENERGY AND COMBUSTION SCIENCE16159.00
    Annual Review of Fluid Mechanics16352.90
    IEEE Reviews in Biomedical Engineering027.80
    TRENDS IN BIOTECHNOLOGY19531.30
    Advanced Fiber Materials012.50
    BIOTECHNOLOGY ADVANCES16127.10
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS22226.30
    Chemical Engineering Journal17221.50
    IEEE SIGNAL PROCESSING MAGAZINE15522.40
    同分区等级的其他期刊名称 h-index CiteScore
    COMMUNICATIONS OF THE ACM1899.80
    Qualitative Research in Psychology010.80
    Industrial and Organizational Psychology-Perspectives on Science and Practice05.90
    JOURNAL OF MEDICAL VIROLOGY10523.40
    Travel Medicine and Infectious Disease3717.10
    General Psychiatry018.90
    PSYCHIATRY AND CLINICAL NEUROSCIENCES669.70
    CLINICAL NUCLEAR MEDICINE532.60
    MedComm05.20
    Tourism Geographies022.00


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