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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

2022年12月最新中科院JCR期刊分区表数据(升级版)已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

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期刊名:   ISSN:   研究方向:   IF: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS期刊基本信息Hello,您是该期刊的第393478位访客

基本信息 登录收藏
期刊名字JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

J MATER SCI-MATER EL

LetPub评分
6.7
95人评分
我要评分

声誉
7.2

影响力
5.9

速度
8.3

期刊ISSN0957-4522
微信扫码收藏此期刊
E-ISSN1573-482X
2021-2022最新影响因子
(数据来源于搜索引擎)
注册登录后,查看影响因子和历年趋势图
2021-2022自引率14.00%注册登录后,查看自引率趋势图
h-index 63
CiteScore
CiteScoreSJRSNIPCiteScore排名
4.200.4640.637
学科分区排名百分位
大类:Engineering
小类:Electrical and Electronic Engineering
Q2240 / 708
大类:Engineering
小类:Atomic and Molecular Physics, and Optics
Q277 / 205
大类:Engineering
小类:Electronic, Optical and Magnetic Materials
Q298 / 259
大类:Engineering
小类:Condensed Matter Physics
Q2157 / 415

期刊简介The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
期刊官方网站https://www.springer.com/10854
期刊投稿网址https://www.editorialmanager.com/jmse
作者指南网址https://www.springer.com/10854/submission-guidelines
期刊语言要求Language
Presenting your work in a well-structured manuscript and in well-written English gives it its best chance for editors and reviewers to understand it and evaluate it fairly. Many researchers find that getting some independent support helps them present their results in the best possible light.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS的语言要求,还能让JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人得到更好的审稿体验,让稿件最大限度地被JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢
提交文稿
是否OA开放访问No
通讯方式SPRINGER, VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ
出版商Springer US
涉及的研究方向工程技术-材料科学:综合
出版国家或地区NETHERLANDS
出版语言English
出版周期Monthly
出版年份1990
年文章数 2505注册登录后,查看年文章数趋势图
Gold OA文章占比1.19%
研究类文章占比:
文章 ÷(文章 + 综述)
99.00%
WOS期刊SCI分区
2021-2022年最新版
WOS分区等级:2区

按学科分区
ENGINEERING, ELECTRICAL & ELECTRONIC Q4Q2Q4
PHYSICS, APPLIED Q3Q2Q4
PHYSICS, CONDENSED MATTER Q1Q3Q1
MATERIALS SCIENCE, MULTIDISCIPLINARY Q1Q3Q4
中科院《国际期刊预警
名单(试行)》名单
2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2021年01月发布的2020版:不在预警名单中
中科院SCI期刊分区
2022年12月最新升级版
注册登录后,查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
工程技术 3区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区1区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区3区4区
PHYSICS, APPLIED
物理:应用
3区3区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区2区4区
中科院SCI期刊分区
2021年12月基础版
大类学科小类学科Top期刊综述期刊
工程技术 4区4区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区3区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
2区1区4区
PHYSICS, APPLIED
物理:应用
1区4区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
1区4区4区
中科院SCI期刊分区
2021年12月升级版
大类学科小类学科Top期刊综述期刊
工程技术 4区4区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
1区2区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
3区1区4区
PHYSICS, APPLIED
物理:应用
3区4区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区3区4区
中科院SCI期刊分区
2020年12月旧的升级版
大类学科小类学科Top期刊综述期刊
工程技术 2区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区3区4区
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科学:综合
1区2区4区
PHYSICS, APPLIED
物理:应用
1区1区4区
PHYSICS, CONDENSED MATTER
物理:凝聚态物理
2区3区4区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0957-4522%5BISSN%5D
平均审稿速度期刊官网数据:
平均33 days, Submission to first decision
92 days, Submission to acceptance

网友分享经验:
平均1.5个月
平均录用比例网友分享经验:
90%
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
收稿范围期刊官网数据:
材料现代电子学中的应用的研究论文,期刊涉及的主题广泛,包括新材料(例如化合物和合金)的合成、生长和制备,加工、制造、键合和封装,微观结构的表征,结构-性质关系,电,光,介电和磁性能。以及新材料在电子领域的应用。
收录体裁期刊官网数据:
Research papers, commentaries, introductions, editorials, reports, errata, etc
编辑信息Editor-in-Chief:

Safa Kasap
University of Saskatchewan, Canada

Founding Editor and Former Editor-in-Chief:

Arthur F. W. Willoughby
Southampton University, UK

Deputy Editors-in-Chief:

Jun Luo
Chinese Academy of Sciences, China

Patrick J. McNally
Dublin City University, Ireland

Editors:

Peter Capper
Selex ES, UK

Homero Castaneda-Lopez
Texas A&M University, USA

Kalyan Kumar Chattopadhyay
Javadpur University, India

I.M. Dharmadasa
Sheffield Hallam University, UK

Chris Groves
Durham University, UK

C. Robert Kao
National Taiwan University, Taiwan

Maurizio Martino
Università del Salento, Italy

Yun Hau Ng
City University of Hong Kong, Hong Kong

Amlan J. Pal
Indian Association for the Cultivation of Science, India

Henry H. Radamson
Royal Institute of Technology, Sweden

Karthik Shankar
University of Alberta, Canada

Velumani Subramaniam
CINVESTAV, Mexico

Stephen Sweeney
University of Surrey, UK

Hongjing Wu
Northwestern Polytechnical University, China

Wu Yan
China University of Geosciences (Wuhan), China

Ying Yang
Tsinghua University, China

Bangmin Zhang
Sun Yat-Sen University, China

Fu Rong Zhu
Hong Kong Baptist University, Hong Kong

Assistant Editor:

Chunzi Zhang
University of Saskatchewan, Canada

Editorial Board:

Sadao Adachi, Gunma University, Japan; Dan Allwood, University of Sheffield, UK; Hajime Asahi, Osaka University, Japan; Neil S. Beattie Northumbria University, UK; Bhaskar Bhattacharya, Banaras Hindu University, India; Rana Biswas, Ames Laboratory & Iowa State University, USA; Anna Paola Caricato, Università del Salento, Italy; Y.C. (Archie) Chan, City University of Hong Kong, China; Parthasarathi Chakraborti, Intel Corporation, Hillsboro, Oregon, USA; Nandu Chaure, Savitribai Phule Pune University, India; Kunji Chen, Nanjing University, China; W. (Jim) Choyke, University of Pittsburgh, USA; Antonin Fejfar, Academy of Sciences of the Czech Republic, Czech Republic; Darrel Frear, Freescale Semiconductor, USA; Jan Evans-Freeman, University of Canterbury, New Zealand; Shubhra Gangopadhyay, University of Missouri-Columbia, USA; Christopher Gourlay, Imperial College London, UK; Jong Heo, Pohang University of Science and Technology, Korea; Dan Hewak, University of Southampton, UK; Oliver Ileperuma, Institute of Chemistry Ceylon, Sri Lanka; Alessia Irrera CNR- Institute for Chemical and Physical Processes (IPCF), Messina, Italy; Stuart J. C. Irvine, Swansea University, UK; Chennupati Jagadish, The Australian National University, Australia; David Jiles, Iowa State University, USA; Hannah J. Joyce, Cambridge University, UK; Zahangir Kabir; Concordia University, Canada; Karen Kavanagh, Simon Fraser University, Canada; Iwan Kityk Czestochowa University of Technology, Poland; Chien-Neng Liao, National Tsing Hua University, Taiwan; Leszek Malkinski, University of New Orleans, USA; Budhika Mendis Durham University, UK; Maria Mitkova Boise State University, USA; Yashowanta Mohapatra, Indian Institute of Technology Kanpur, India; Hadis Morkoç, Virginia Commonwealth University, USA; Hiroyoshi Naito, Osaka Prefecture University, Japan; Hiroshi Nishikawa, Osaka University, Japan; Habib Pathan, Savitribai Phule Pune University, India; Kristin M. Poduska, Memorial University of Newfoundland, Canada; Adithya Prakash, Intersil, USA; Jatin Rath Indian Institute of Technology, Madras, India; Alla Reznik Lakehead University, Thunder Bay, Canada; Ben Ruck, Victoria University of Wellingon, New Zealand; Harry Ruda, University of Toronto, Canada; Arie Ruzin Tel Aviv University, Israel; Rene van Swaaij, Delft University of Technology, The Netherlands; Katsuhisa Tanaka, Kyoto University, Japan; Ayse Turak, McMaster University, Canada; Takashi Uchino, Kobe University, Japan; Neil White, University of Southampton, UK; Takayuki Yanagida, Nara Institute of Science and Technology, Japan; Alex (Ya Sha) Yi, University of Michigan, USA
期刊常用信息链接
同领域相关期刊 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊


以上SCI期刊相关数据和信息来源于网络,仅供参考。
投稿状态统计: 我要评分:

    同领域作者分享投稿经验:共207条 (包含回复)

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