2022年12月最新中科院JCR期刊分区表数据(升级版)已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎
反馈给我们。 ![]() |
基本信息 | 登录收藏 | |||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
期刊名字![]() | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS J MATER SCI-MATER EL LetPub评分 6.7
95人评分
我要评分
声誉 7.2 影响力 5.9 速度 8.3 | |||||||||||||||||||||||||||||
期刊ISSN | 0957-4522 | 微信扫码收藏此期刊 | ||||||||||||||||||||||||||||
E-ISSN | 1573-482X | |||||||||||||||||||||||||||||
2021-2022最新影响因子 (数据来源于搜索引擎) | 注册或登录后,查看影响因子和历年趋势图 | |||||||||||||||||||||||||||||
2021-2022自引率 | 14.00%注册或登录后,查看自引率趋势图 | |||||||||||||||||||||||||||||
h-index | 63 | |||||||||||||||||||||||||||||
CiteScore |
| |||||||||||||||||||||||||||||
期刊简介 | The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials. | |||||||||||||||||||||||||||||
期刊官方网站 | https://www.springer.com/10854 | |||||||||||||||||||||||||||||
期刊投稿网址 | https://www.editorialmanager.com/jmse | |||||||||||||||||||||||||||||
作者指南网址 | https://www.springer.com/10854/submission-guidelines | |||||||||||||||||||||||||||||
期刊语言要求 | Language Presenting your work in a well-structured manuscript and in well-written English gives it its best chance for editors and reviewers to understand it and evaluate it fairly. Many researchers find that getting some independent support helps them present their results in the best possible light. 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS的语言要求,还能让JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人得到更好的审稿体验,让稿件最大限度地被JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色,同行资深专家修改润色,SCI论文专业翻译,SCI论文格式排版,专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||||||||||
是否OA开放访问 | No | |||||||||||||||||||||||||||||
通讯方式 | SPRINGER, VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ | |||||||||||||||||||||||||||||
出版商 | Springer US | |||||||||||||||||||||||||||||
涉及的研究方向 | 工程技术-材料科学:综合 | |||||||||||||||||||||||||||||
出版国家或地区 | NETHERLANDS | |||||||||||||||||||||||||||||
出版语言 | English | |||||||||||||||||||||||||||||
出版周期 | Monthly | |||||||||||||||||||||||||||||
出版年份 | 1990 | |||||||||||||||||||||||||||||
年文章数 | 2505注册或登录后,查看年文章数趋势图 | |||||||||||||||||||||||||||||
Gold OA文章占比 | 1.19% | |||||||||||||||||||||||||||||
研究类文章占比: 文章 ÷(文章 + 综述) | 99.00% | |||||||||||||||||||||||||||||
WOS期刊SCI分区 ( 2021-2022年最新版) | WOS分区等级:2区
| |||||||||||||||||||||||||||||
中科院《国际期刊预警 名单(试行)》名单 | 2023年01月发布的2023版:不在预警名单中 2021年12月发布的2021版:不在预警名单中 2021年01月发布的2020版:不在预警名单中 | |||||||||||||||||||||||||||||
中科院SCI期刊分区 ( 2022年12月最新升级版) | 注册或登录后,查看中科院SCI期刊分区趋势图
| |||||||||||||||||||||||||||||
中科院SCI期刊分区 ( 2021年12月基础版) |
| |||||||||||||||||||||||||||||
中科院SCI期刊分区 ( 2021年12月升级版) |
| |||||||||||||||||||||||||||||
中科院SCI期刊分区 ( 2020年12月旧的升级版) |
| |||||||||||||||||||||||||||||
SCI期刊收录coverage | Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE) Scopus (CiteScore) | |||||||||||||||||||||||||||||
PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0957-4522%5BISSN%5D | |||||||||||||||||||||||||||||
平均审稿速度 | 期刊官网数据: 平均33 days, Submission to first decision 92 days, Submission to acceptance 网友分享经验: 平均1.5个月 | |||||||||||||||||||||||||||||
平均录用比例 | 网友分享经验: 90% | |||||||||||||||||||||||||||||
LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色,同行资深专家修改润色,SCI论文专业翻译,SCI论文格式排版,专业学术制图等)后论文在JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS顺利发表。
快看看作者怎么说吧:服务好评 论文致谢 | |||||||||||||||||||||||||||||
收稿范围 | 期刊官网数据: 材料现代电子学中的应用的研究论文,期刊涉及的主题广泛,包括新材料(例如化合物和合金)的合成、生长和制备,加工、制造、键合和封装,微观结构的表征,结构-性质关系,电,光,介电和磁性能。以及新材料在电子领域的应用。 | |||||||||||||||||||||||||||||
收录体裁 | 期刊官网数据: Research papers, commentaries, introductions, editorials, reports, errata, etc | |||||||||||||||||||||||||||||
编辑信息 | Editor-in-Chief: Safa Kasap University of Saskatchewan, Canada Founding Editor and Former Editor-in-Chief: Arthur F. W. Willoughby Southampton University, UK Deputy Editors-in-Chief: Jun Luo Chinese Academy of Sciences, China Patrick J. McNally Dublin City University, Ireland Editors: Peter Capper Selex ES, UK Homero Castaneda-Lopez Texas A&M University, USA Kalyan Kumar Chattopadhyay Javadpur University, India I.M. Dharmadasa Sheffield Hallam University, UK Chris Groves Durham University, UK C. Robert Kao National Taiwan University, Taiwan Maurizio Martino Università del Salento, Italy Yun Hau Ng City University of Hong Kong, Hong Kong Amlan J. Pal Indian Association for the Cultivation of Science, India Henry H. Radamson Royal Institute of Technology, Sweden Karthik Shankar University of Alberta, Canada Velumani Subramaniam CINVESTAV, Mexico Stephen Sweeney University of Surrey, UK Hongjing Wu Northwestern Polytechnical University, China Wu Yan China University of Geosciences (Wuhan), China Ying Yang Tsinghua University, China Bangmin Zhang Sun Yat-Sen University, China Fu Rong Zhu Hong Kong Baptist University, Hong Kong Assistant Editor: Chunzi Zhang University of Saskatchewan, Canada Editorial Board: Sadao Adachi, Gunma University, Japan; Dan Allwood, University of Sheffield, UK; Hajime Asahi, Osaka University, Japan; Neil S. Beattie Northumbria University, UK; Bhaskar Bhattacharya, Banaras Hindu University, India; Rana Biswas, Ames Laboratory & Iowa State University, USA; Anna Paola Caricato, Università del Salento, Italy; Y.C. (Archie) Chan, City University of Hong Kong, China; Parthasarathi Chakraborti, Intel Corporation, Hillsboro, Oregon, USA; Nandu Chaure, Savitribai Phule Pune University, India; Kunji Chen, Nanjing University, China; W. (Jim) Choyke, University of Pittsburgh, USA; Antonin Fejfar, Academy of Sciences of the Czech Republic, Czech Republic; Darrel Frear, Freescale Semiconductor, USA; Jan Evans-Freeman, University of Canterbury, New Zealand; Shubhra Gangopadhyay, University of Missouri-Columbia, USA; Christopher Gourlay, Imperial College London, UK; Jong Heo, Pohang University of Science and Technology, Korea; Dan Hewak, University of Southampton, UK; Oliver Ileperuma, Institute of Chemistry Ceylon, Sri Lanka; Alessia Irrera CNR- Institute for Chemical and Physical Processes (IPCF), Messina, Italy; Stuart J. C. Irvine, Swansea University, UK; Chennupati Jagadish, The Australian National University, Australia; David Jiles, Iowa State University, USA; Hannah J. Joyce, Cambridge University, UK; Zahangir Kabir; Concordia University, Canada; Karen Kavanagh, Simon Fraser University, Canada; Iwan Kityk Czestochowa University of Technology, Poland; Chien-Neng Liao, National Tsing Hua University, Taiwan; Leszek Malkinski, University of New Orleans, USA; Budhika Mendis Durham University, UK; Maria Mitkova Boise State University, USA; Yashowanta Mohapatra, Indian Institute of Technology Kanpur, India; Hadis Morkoç, Virginia Commonwealth University, USA; Hiroyoshi Naito, Osaka Prefecture University, Japan; Hiroshi Nishikawa, Osaka University, Japan; Habib Pathan, Savitribai Phule Pune University, India; Kristin M. Poduska, Memorial University of Newfoundland, Canada; Adithya Prakash, Intersil, USA; Jatin Rath Indian Institute of Technology, Madras, India; Alla Reznik Lakehead University, Thunder Bay, Canada; Ben Ruck, Victoria University of Wellingon, New Zealand; Harry Ruda, University of Toronto, Canada; Arie Ruzin Tel Aviv University, Israel; Rene van Swaaij, Delft University of Technology, The Netherlands; Katsuhisa Tanaka, Kyoto University, Japan; Ayse Turak, McMaster University, Canada; Takashi Uchino, Kobe University, Japan; Neil White, University of Southampton, UK; Takayuki Yanagida, Nara Institute of Science and Technology, Japan; Alex (Ya Sha) Yi, University of Michigan, USA | |||||||||||||||||||||||||||||
期刊常用信息链接 |
|
|
|
注册或登录后,查看自引率趋势图 |
注册或登录后,查看中科院SCI期刊分区趋势图 |
注册或登录后,查看年文章数趋势图 |
中国学者近期发表的论文 | |
1. | Solvothermal synthesis of ultra-fine silver nanowires with a diameter about 20 nm and an aspect ratio approximately 2000 for highly conductive flexible transparent film Author: Yuxiu Li, Ximin Yuan, Hongwei Yang, Yunxiu Chao, Shuailong Guo, Chuan Wang Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01216-0 DOI |
2. | Red-emitting phosphor series: Ca<Subscript>9</Subscript>Y(PO<Subscript>4</Subscript>)<Subscript>7(1-x</Subscript>)(VO<Subscript>4</Subscript>)<Subscript>7x</Subscript>:Eu<Superscript>3+</Superscript> (x = 0 − 1) with improved luminescence thermal stability by anionic polyhedron substitution Author: Z. Z. Zhang, F. Zhang, G. Q. Li, Jia Zhang, W. F. Zhang Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01210-6 DOI |
3. | Investigation on phase and microstructures of a temperature stable high-Q Li<Subscript>2</Subscript>Zn<Subscript>0.95</Subscript>Sr<Subscript>0.05</Subscript>Ti<Subscript>3</Subscript>O<Subscript>8</Subscript> microwave dielectric ceramic Author: Haishen Ren, Zhilun Wu, Fei He, Yi Zhang, Xiangyu Zhao, Xiaogang Yao, Huixing Lin Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01208-0 DOI |
4. | Synthesis, characterization and charge storage properties of C<Subscript>60</Subscript>-fullerene microparticles as a flexible negative electrode for supercapacitors Author: Abdul Jabbar Khan, Muddasir Hanif, Muhammad Sufyan Javed, Shahid Hussain, Zhongwu Liu Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01177-4 DOI |
5. | Substantial enhancement of mechanical properties for SnSe based composites with potassium titanate whiskers Author: Junchao Li, Bo Duan, Jialiang Li, Zheng Ruan, Tao Gao, Zhou Fang, Guodong Li, Pengcheng Zhai, Gang Chen Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01170-x DOI |
6. | Two step method for preparing TiO<Subscript>2</Subscript>/Ag/rGO heterogeneous nanocomposites and its photocatalytic activity under visible light irradiation Author: Tian Tang, Tao Wang, Yang Gao, Huan Xiao, JiaHui Xu Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01167-6 DOI |
7. | Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>-based p-i-n solar blind deep ultraviolet photodetectors Author: Li-Yi Jian, Hsin-Ying Lee, Ching-Ting Lee Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01163-w DOI |
8. | Effects of particle size on electromagnetic properties of spherical carbonyl iron Author: Chaoqun Ge, Liuying Wang, Gu Liu, Tao Wang, Haiqing Chen Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01156-9 DOI |
9. | A facile method for the preparation of furfurylamine based benzoxazine resin with high-frequency low dielectric constants and ultra-low dielectric losses Author: Tao Pang, Ming Zeng, Zijian Feng, Jiangbing Chen, Yiwan Huang, Qingyu Xu Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01153-y DOI |
10. | Effect of microscopic-ordered structures on intrinsic thermal conductivity of liquid-crystalline polysiloxane Author: Ying Li, Chenggong Li, Liang Zhang, Wenying Zhou Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, Vol., , DOI:10.1007/s10854-019-01150-1 DOI |
|
|
以上SCI期刊相关数据和信息来源于网络,仅供参考。
投稿状态统计: 我要评分: | |
同领域作者分享投稿经验:共207条 (包含回复) |
我来分享 |
|
联系我们 | 站点地图 | 友情链接 | 授权代理商 | 加入我们
© 2010-2023 中国: LetPub上海分公司 网站备案号:沪ICP备10217908号-1 沪公网安备号:31010402006960
增值电信业务经营许可证:沪B2-20211595
礼翰商务信息咨询(上海)有限公司 办公地址:上海市徐汇区漕溪北路88号圣爱大厦2103室
United States: Tel: 1-781-202-9968 Address: 400 5th Ave, Suite 530, Waltham, Massachusetts 02451