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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

2023年12月最新中科院分区表数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 IEEE T ELECTROM最新评论:具体按时间节点有吗 (2023-01-15)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY期刊基本信息Hello,您是该期刊的第69867位访客

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期刊名字IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

IEEE T ELECTROMAGN C
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
5.6
53人评分
我要评分

声誉
6.4

影响力
4.3

速度
8.2

期刊ISSN0018-9375
微信扫码收藏此期刊
2022-2023最新影响因子
(数据来源于搜索引擎)
2.1 点击查看影响因子趋势图
实时影响因子 截止2024年3月26日:1.973
2022-2023自引率19.00%点击查看自引率趋势图
五年影响因子2.1
h-index 82
CiteScore
CiteScoreSJRSNIPCiteScore排名
4.700.9711.358
学科分区排名百分位
大类:Engineering
小类:Electrical and Electronic Engineering
Q2256 / 738
大类:Engineering
小类:Condensed Matter Physics
Q2150 / 423
大类:Engineering
小类:Atomic and Molecular Physics, and Optics
Q276 / 211

期刊简介
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
期刊官方网站http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
期刊投稿网址http://mc.manuscriptcentral.com/temc-ieee
期刊语言要求经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY的语言要求,还能让IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY编辑和审稿人得到更好的审稿体验,让稿件最大限度地被IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢
提交文稿
是否OA开放访问No
通讯方式IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
出版商Institute of Electrical and Electronics Engineers Inc.
涉及的研究方向工程技术-电信学
出版国家或地区UNITED STATES
出版语言English
出版周期Quarterly
出版年份0
年文章数 222点击查看年文章数趋势图
Gold OA文章占比8.36%
研究类文章占比:
文章 ÷(文章 + 综述)
100.00%
WOS期刊SCI分区
2022-2023年最新版
WOS分区等级:3区

按学科分区JIF分区JIF排名JIF百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC
类别:SCIE
Q3179/275
学科:TELECOMMUNICATIONS
类别:SCIE
Q364/88
中科院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:不在预警名单中

2021年12月发布的2021版:不在预警名单中

2020年12月发布的2020版:不在预警名单中
中科院SCI期刊分区
2023年12月最新升级版
点击查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
计算机科学 4区3区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区3区3区
TELECOMMUNICATIONS
电信学
2区3区3区
中科院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
计算机科学 2区3区1区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
4区3区3区
TELECOMMUNICATIONS
电信学
3区4区3区
中科院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
计算机科学 4区2区2区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
1区4区3区
TELECOMMUNICATIONS
电信学
1区3区3区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0018-9375%5BISSN%5D
平均审稿速度网友分享经验:
平均2.0个月
平均录用比例网友分享经验:
容易
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
期刊常用信息链接
同领域相关期刊 IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS21125.40
    IEEE WIRELESS COMMUNICATIONS13926.00
    IEEE COMMUNICATIONS MAGAZINE21321.10
    IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS18616.90
    IEEE NETWORK11119.90
    IEEE TRANSACTIONS ON COMMUNICATIONS18813.60
    IEEE TRANSACTIONS ON MOBILE COMPUTING12213.10
    IEEE TRANSACTIONS ON MULTIMEDIA10813.10
    IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY14613.60
    Progress in Electromagnetics Research-PIER807.20
    中科院SCI期刊分区同大类学科的热搜期刊 浏览次数
    IEEE Access2791355
    NEUROCOMPUTING1165471
    EXPERT SYSTEMS WITH APPLICATIONS907495
    INFORMATION SCIENCES903078
    IEEE Transactions on Industrial Informatics741919
    KNOWLEDGE-BASED SYSTEMS737544
    APPLIED INTELLIGENCE667695
    APPLIED SOFT COMPUTING616946
    NEURAL COMPUTING & APPLICATIONS576847
    IEEE Transactions on Cybernetics564818
  •  

    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
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  •  

     
  •  

     
  • 中国学者近期发表的论文
    1.Self-Switchable Broadband Waveguide Protector Against High Power Microwave

    Author: Huang, Ruiqi; Liu, Jibin; Liu, Chenxi; Hu, Ning; Zha, Song
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 355-359. DOI: 10.1109/TEMC.2022.3201577
        DOI
    2.Liquid Based Wideband and Switchable 3-D Frequency-Selective Rasorber

    Author: Kong, Xiangkun; Wang, Xuemeng; Jin, Xin; Lin, Weihao; Kong, Lingqi; Jiang, Shunliu; Xing, Lei
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 88-95. DOI: 10.1109/TEMC.2022.3209536
        DOI
    3.Integrated Model for Lightning Strikes on a Tall Structure: Application to a Wind Turbine System

    Author: Li, Zhe; Ding, Yuxuan; Du, Yaping; Cao, Jinxin; Chen, Mingli
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 271-280. DOI: 10.1109/TEMC.2022.3215825
        DOI
    4.An Intelligent Method Based on Time-Frequency Analysis and Deep Learning Semantic Segmentation for Investigating the Electromagnetic Pulse Features of Engine Digital Controllers

    Author: Wei, Minxiang; Chen, Kai; Cao, Jie; Li, Shunming; Ali, Amjad
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 257-270. DOI: 10.1109/TEMC.2022.3218717
        DOI
    5.Passive Interference Characteristics of Transmission Lines on Rough Ground and Optimization of Protection Spacing

    Author: Yu, Pengcheng; Jiao, Chaoqun; Zhang, Jiangong; Gan, Zheyuan
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 343-354. DOI: 10.1109/TEMC.2022.3218690
        DOI
    6.Deep Reinforcement Learning-Based Ground-Via Placement Optimization for EMI Mitigation

    Author: Gu, Zheming; Zhang, Ling; Jin, Hang; Tao, Tuomin; Li, Da; Li, Er-Ping
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 2, pp. 564-573. DOI: 10.1109/TEMC.2022.3222034
        DOI
    7.Time-Domain Hybrid Method for the Coupling Analysis of Power Line Network With Curved and Multidirectional Segments

    Author: Ye, Zhihong; Shi, Yanchao; Gao, Zhiwei; Wu, Xiaolin
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 216-224. DOI: 10.1109/TEMC.2022.3222208
        DOI
    8.The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform

    Author: Song, Kaixuan; Gao, Jinchun; Flowers, George T.; Wang, Ziren; Wang, Chaoyi; Yi, Wei; Cheng, Zhongyang
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. 65, Issue 1, pp. 312-322. DOI: 10.1109/TEMC.2022.3221164
        DOI
    9.A Dual-Sided LCLC Topology for AGV Wireless Charging System With Low Leakage EMF

    Author: Li, Yanling; Ying, Yangjiang; Xie, Kaiwen; Pan, Shuaishuai
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. , Issue , pp. -. DOI: 10.1109/TEMC.2023.3263906
        DOI
    10.Magnetic Coupling Mechanism With Omnidirectional Magnetic Shielding for Wireless Power Transfer

    Author: Dai, Zhongyu; Zhang, Xian; Liu, Tianqi; Pei, Chao; Chen, Ting; Dou, Runtian; Wang, Junhua
    Journal: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. 2023; Vol. , Issue , pp. -. DOI: 10.1109/TEMC.2023.3266089
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    IEEE Communications Surveys and Tutorials14782.50
    Science Robotics033.50
    Nature Machine Intelligence032.70
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32630.40
    COMMUNICATIONS OF THE ACM1899.80
    PROCEEDINGS OF THE IEEE25031.60
    INTERNATIONAL JOURNAL OF COMPUTER VISION17222.50
    Information Fusion8538.60
    ACM COMPUTING SURVEYS13228.50
    IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS21125.40
    同分区等级的其他期刊名称 h-index CiteScore
    COMMUNICATIONS OF THE ACM1899.80
    Qualitative Research in Psychology010.80
    Industrial and Organizational Psychology-Perspectives on Science and Practice05.90
    JOURNAL OF MEDICAL VIROLOGY10523.40
    Travel Medicine and Infectious Disease3717.10
    General Psychiatry018.90
    PSYCHIATRY AND CLINICAL NEUROSCIENCES669.70
    CLINICAL NUCLEAR MEDICINE532.60
    MedComm05.20
    Tourism Geographies022.00


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