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Creep response of thixotropic ambient temperature cure adhesives measured by DMTA in static tension and shear

ASM Roseley, E Rojo, MP Ansell… - International Journal of …, 2011 - Elsevier
... release agen s. A load w adhesive wa e obtained w ns (1mm an en geometr ndwich for s ood
venee hesive tape days, specim e through on ce the ... e layer of v ed central zo force at the actured
by tic two-par ly known ystem speci GFRP or C containing rt clustering e curing ag n ...
All 2 versions

UV-nanoimprinting using non-transparent molds and non-transparent substrates

R Kirchner, A Finn, L Teng, M Ploetner… - Microelectronic …, 2011 - Elsevier
... Again, the light could not131 pass directly through the non-transparent Si chip during132 the
ood exposure.133 2 customized imprint pressAL6-2 contact exposure ... This135 chamber provided
additionally a N 2 atmosphere to elim-136 inate the oxygen curing inhibition.137 2.3. ...
Cited by 1 - Related articles

Self-Primed Coating Formulation and Universal, Printable, Plastic Media Coated with the Formulation

J Li - US Patent 20,110,200,803, 2011 - freepatentsonline.com
... Method, rod #40, rod #40, rod #40, rod #40, rod #40. Curing Temp, 170, 70, 120, 120, 170. °
C. Curing Time, 5, 5, 5, 5, 5. (min). Adhesion, G ood, Good, Good, Good, Good. Scratch/, Good,
Good, Good, Good, Good. Abrasion. Resistance. Chemical/, Good, Good, Good, Good, Good ...
Cached

Liquid discharge head and method for manufacturing the same

S Shiba, A Okano, Y Saito, K Asai… - US Patent …, 2011 - freepatentsonline.com
... 0.048, 75< /td>, Excellent, 88, Good. 0 .060, 73, Good, 88, Good. 0.070, 72, Good, 87, G ood.
0.072, Non-, Poor, 87, Good. resolvable. < /tgroup> 0.078, Insufficient curing (#2), Insufficient
curing. *1 Example 1 (focus −15 μm),. *2 Example 2 (formation of tapered and straight shapes ...
Related articles - Cached - All 2 versions

[CITATION] Voice of the Blood

J Jefferson - 2011 - Dorchester Publishing

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