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MICROPROCESSORS AND MICROSYSTEMS

2023年12月最新中科院分区表数据已经更新,欢迎查询! 如果您对期刊系统有任何需求或者问题,欢迎点击此处反馈给我们。

按期刊名首写字母查看 MICROPROCESS MI最新评论:破期刊终于上预警名单了,活该 (2022-01-02)


期刊名:   ISSN:   研究方向:   影响因子: -   SCI收录:
大类学科:   小类学科:   中科院分区:   是否OA期刊:   结果排序:

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MICROPROCESSORS AND MICROSYSTEMS期刊基本信息Hello,您是该期刊的第44168位访客


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期刊名字MICROPROCESSORS AND MICROSYSTEMSMICROPROCESSORS AND MICROSYSTEMS

MICROPROCESS MICROSY
(此期刊被最新的JCR期刊SCIE收录)

LetPub评分
5.1
54人评分
我要评分

声誉
6.2

影响力
3.7

速度
7.9

期刊ISSN0141-9331
微信扫码收藏此期刊
2022-2023最新影响因子
(数据来源于搜索引擎)
2.6 点击查看影响因子趋势图
实时影响因子 截止2024年3月26日:1.734
2022-2023自引率3.80%点击查看自引率趋势图
五年影响因子2.2
h-index 33
CiteScore
CiteScoreSJRSNIPCiteScore排名
4.900.4880.882
学科分区排名百分位
大类:Computer Science
小类:Computer Networks and Communications
Q2125 / 379
大类:Computer Science
小类:Hardware and Architecture
Q266 / 169
大类:Computer Science
小类:Software
Q2165 / 404
大类:Computer Science
小类:Artificial Intelligence
Q2128 / 301

期刊简介
Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).

Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.
期刊官方网站http://www.journals.elsevier.com/microprocessors-and-microsystems/
期刊投稿网址https://www.editorialmanager.com/MICPRO
期刊语言要求Language
Please write your text in good English (American or British usage is accepted, but not a mixture of these). Authors who feel their English language manuscript may require editing to eliminate possible grammatical or spelling errors and to conform to correct scientific English may wish to use the English Language Editing service.

经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件,不仅能满足MICROPROCESSORS AND MICROSYSTEMS的语言要求,还能让MICROPROCESSORS AND MICROSYSTEMS编辑和审稿人得到更好的审稿体验,让稿件最大限度地被MICROPROCESSORS AND MICROSYSTEMS编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)帮助作者准备稿件,已助力全球15万+作者顺利发表论文。部分发表范例可查看:服务好评 论文致谢
提交文稿
是否OA开放访问No
通讯方式ELSEVIER SCIENCE BV, PO BOX 211, AMSTERDAM, NETHERLANDS, 1000 AE
出版商Elsevier
涉及的研究方向工程技术-工程:电子与电气
出版国家或地区NETHERLANDS
出版语言English
出版周期Bimonthly
出版年份1978
年文章数 209点击查看年文章数趋势图
Gold OA文章占比2.16%
研究类文章占比:
文章 ÷(文章 + 综述)
98.56%
WOS期刊SCI分区
2022-2023年最新版
WOS分区等级:2区

按学科分区JIF分区JIF排名JIF百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
类别:SCIE
Q227/54
学科:COMPUTER SCIENCE, THEORY & METHODS
类别:SCIE
Q249/111
学科:ENGINEERING, ELECTRICAL & ELECTRONIC
类别:SCIE
Q3145/275
中科院《国际期刊预警
名单(试行)》名单
2024年02月发布的2024版:不在预警名单中

2023年01月发布的2023版:预警等级:高

2021年12月发布的2021版:预警等级:高

2020年12月发布的2020版:不在预警名单中
中科院SCI期刊分区
2023年12月最新升级版
点击查看中科院SCI期刊分区趋势图
大类学科小类学科Top期刊综述期刊
计算机科学 2区4区3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
计算机:硬件
1区1区4区
COMPUTER SCIENCE, THEORY & METHODS
计算机:理论方法
2区4区4区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区3区4区
中科院SCI期刊分区
2022年12月升级版
大类学科小类学科Top期刊综述期刊
计算机科学 1区3区1区
COMPUTER SCIENCE, THEORY & METHODS
计算机:理论方法
2区2区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
3区2区3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
计算机:硬件
3区1区4区
中科院SCI期刊分区
2021年12月旧的升级版
大类学科小类学科Top期刊综述期刊
计算机科学 3区4区3区
COMPUTER SCIENCE, THEORY & METHODS
计算机:理论方法
4区2区3区
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:电子与电气
2区2区3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
计算机:硬件
3区2区4区
SCI期刊收录coverage Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)
Scopus (CiteScore)
PubMed Central (PMC)链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0141-9331%5BISSN%5D
平均审稿速度网友分享经验:
较慢,6-12周
平均录用比例网友分享经验:
容易
LetPub助力发表经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍,平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务(包括SCI论文英语润色同行资深专家修改润色SCI论文专业翻译SCI论文格式排版专业学术制图等)后论文在MICROPROCESSORS AND MICROSYSTEMS顺利发表。
快看看作者怎么说吧:服务好评 论文致谢
在线出版周期来源Elsevier官网:
平均18.8周
期刊常用信息链接
同领域相关期刊 MICROPROCESSORS AND MICROSYSTEMS期刊近年CiteScore指标趋势图
该杂志的自引率趋势图 MICROPROCESSORS AND MICROSYSTEMS中科院SCI期刊分区趋势图
该杂志的年文章数趋势图 同领域作者分享投稿经验
MICROPROCESSORS AND MICROSYSTEMS上中国学者近期发表的论文  
  • 同领域相关期刊
  • 期刊CiteScore趋势图
  • 期刊自引率趋势图
  • 中科院SCI期刊分区趋势图
  • 年文章数趋势图
  • 该期刊中国学者近期发表论文
  • 中科院SCI期刊分区相关期刊
  • 同类著名期刊名称 h-index CiteScore
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32630.40
    PROCEEDINGS OF THE IEEE25031.60
    IEEE SIGNAL PROCESSING MAGAZINE15522.40
    IEEE TRANSACTIONS ON FUZZY SYSTEMS17019.00
    PROGRESS IN QUANTUM ELECTRONICS5815.60
    IEEE TRANSACTIONS ON IMAGE PROCESSING24218.20
    IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING14812.40
    EXPERT SYSTEMS WITH APPLICATIONS16212.60
    IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS11211.60
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY15411.20
    中科院SCI期刊分区同大类学科的热搜期刊 浏览次数
    IEEE Access2810565
    NEUROCOMPUTING1178847
    EXPERT SYSTEMS WITH APPLICATIONS925383
    INFORMATION SCIENCES914383
    IEEE Transactions on Industrial Informatics753103
    KNOWLEDGE-BASED SYSTEMS748717
    APPLIED INTELLIGENCE679478
    APPLIED SOFT COMPUTING626356
    NEURAL COMPUTING & APPLICATIONS586368
    IEEE Transactions on Cybernetics570972
  •  

    MICROPROCESSORS AND MICROSYSTEMS MICROPROCESSORS AND MICROSYSTEMS
    我来预测明年:
    稳步上升 表现平稳 逐渐下降  刷新
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  • 中国学者近期发表的论文
    1.Power Inspection Design by Internet of Things and RFID Technology in Smart City

    Author: Yang, Bo; Tang, Jun; Dong, Xiaofeng; Li, Shi; Gu, Ren; Hao, Junhua
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104510
        DOI
    2.A simple and effective multi-person pose estimation model for low power embedded system

    Author: Li, Hua; Wen, Shiping; Shi, Kaibo
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104739
        DOI
    3.A lattice Boltzmann model for the Navier-Stokes equation

    Author: Xu, Wenchao; Yan, Guangwu
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2021.104391
        DOI
    4.Road surface state recognition using deep convolution network on the embedded device

    Author: Gin, QiXin; Wang, Guangying; Wang, Lei; Cheng, Jun; Fang, Hao
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104740
        DOI
    5.A new idea in response to fast correlation attacks on small-state stream ciphers

    Author: Ghafari, Vahid Amin; Lin, Fujiang; Zhou, Zhongzhi
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104720
        DOI
    6.Lightweight image super-resolution via overlapping back-projection feedback network for embedded devices

    Author: Wang, Beibei; Liu, Changjun; Yan, Binyu; Jeon, Seunggil; Yang, Xiaomin; Zhang, Zhuoyue
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104777
        DOI
    7.Convolutional networks with short-term memory effects

    Author: Gong, Chencheng; Chen, Ling; Liu, Xin
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104779
        DOI
    8.An end-to-end medical image fusion network based on Swin-transformer

    Author: Yu, Kaixin; Yang, Xiaoming; Jeon, Seunggil; Dou, Qingyu
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104781
        DOI
    9.A sparse convolution neural network accelerator with bandwidth-efficient data loopback structure

    Author: Yuan, Haiying; Zeng, Zhiyong
    Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104810
        DOI
    10.Design space exploration of heterogeneous MPSoCs with variable number of hardware accelerators

    Author: Siyuan Xu, Shuangnan Liu, Yidi Liu, Anushree Mahapatra, Mónica Villaverde, Félix Moreno, Benjamin Carrion Schafer
    Journal: MICROPROCESSORS AND MICROSYSTEMS, 2019, Vol.65, 169-179, DOI:10.1016/j.micpro.2019.01.010
        DOI
  • 同大类学科的其他著名期刊名称 h-index CiteScore
    IEEE Communications Surveys and Tutorials14782.50
    Science Robotics033.50
    Nature Machine Intelligence032.70
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32630.40
    COMMUNICATIONS OF THE ACM1899.80
    PROCEEDINGS OF THE IEEE25031.60
    INTERNATIONAL JOURNAL OF COMPUTER VISION17222.50
    Information Fusion8538.60
    ACM COMPUTING SURVEYS13228.50
    IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS21125.40
    同分区等级的其他期刊名称 h-index CiteScore
    HARVARD BUSINESS REVIEW02.40
    QJM-AN INTERNATIONAL JOURNAL OF MEDICINE1086.10
    Energy Material Advances08.50
    CLINICAL AND EXPERIMENTAL HYPERTENSION453.60
    Journal of Public Transportation07.00
    Asian Journal of Psychiatry010.90
    Chinese Journal of Population Resources and Environment02.60
    VIEW08.60
    HLA933.00
    INTERNATIONAL JOURNAL OF SOCIAL PSYCHIATRY011.50


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